Reflow sn plated member
作者： Naofumi Maeda
DOI:
关键词:
摘要: A reflow Sn plated material, comprising: a substrate consisting of Cu or base alloy, and layer formed on the surface substrate, wherein an orientation index (101) plane is from 2.0 more to 5.0 less.
lens.org 参考文章(11)
A. Egli, Wan Zhang, F. Schwager, New approaches to whisker free tin deposits electronics packaging technology conference. pp. 55- 58 ,(2003) , 10.1109/EPTC.2003.1271490
Ryoichi Ozaki, Masayasu Nishimura, Masahiro Kawaguchi, Yasuhiro Shintani, Toshihisa Hara, Plated copper alloy material and process for production thereof ,(2004)
Winnie Ruth Vickers, Robert A. Schetty, Minimizing whisker growth in tin electrodeposits ,(2003)
T.S.N. Sankara Narayanan, Young Woo Park, Kang Yong Lee, Fretting corrosion of lubricated tin plated copper alloy contacts: Effect of temperature Tribology International. ,vol. 41, pp. 87- 102 ,(2008) , 10.1016/J.TRIBOINT.2007.05.004
Mitsuru Sakano, Yasufumi Shibata, Shigeru Konda, Isamu Ichikawa, Katsuhito Azuma, Junichi Honda, Takashi Nomura, Satoshi Mizutani, Plated member and method of forming plating layer ,(2009)
真之 長野, Masayuki Nagano, 隆紹 波多野, Takatsugu Hatano, Copper alloy tinned strip having excellent insertion/withdrawal property and heat resistance ,(2005)
Tetsuzo Ogura, 哲造 小倉, Copper alloy material for electronic-electrical parts ,(2001)
Yoshinori Suzuki, Yasuo Inohana, 康雄 猪鼻, 章 菅原, 芳典 鈴木, Akira Sugawara, Copper or copper alloy subjected to plating and method for manufacturing the same ,(2002)
Yasuhiro Morizono, Yasuhide Ohno, Keisuke Tsutsumi, Toshiyuki Kozuka, Method and material for plating film formation ,(2007)
Mitsuru Sakano, Yasufumi Shibata, 隆史 野村, 靖文 柴田, 滋 近田, Shigeru Chikada, 充 坂野, Takashi Nomura, Plated member and method for producing the same ,(2007)