Heat dissipating module and method of combining the same
作者： Shih-Ching Liao , Hung-Chuan Chen
DOI:
关键词: Electronic engineering 、 Mechanical engineering 、 Layer (electronics) 、 Engineering 、 Printed circuit board
摘要: In a heat dissipating module and method of combining the module, includes circuit board, generating component, element, surface mount layer. The board has through hole, component is corresponsive to hole installed on element protruding embedding portion formed other side embedded into hole. layer internal periphery are combined with both surfaces respectively, contacted each
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