Heat Dissipating Assembly
作者： Chi-Hung Kuo , Chih-Hao Chung , Alex Horng
DOI:
关键词:
摘要: A heat dissipating assembly includes a circuit board having opposite first and second faces. The further through-hole extending from the face through face. generating element is mounted on of electrically coupled to board. conducting portion aligned with through-hole. unit base an engaging in contact adhesive filled engaged element. directly by effectively enhance overall efficiency while reducing number members lower manufacturing costs.
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