作者: Paul Schmalenberg , Tsuyoshi Nomura , Jae Seung Lee , Ercan Mehmet Dede
DOI:
关键词: Thermal 、 Materials science 、 Thermal management of electronic devices and systems 、 Thermal conductivity 、 Heat transfer 、 Lamina 、 Composite material 、 Insulator (electricity) 、 Composite number
摘要: Heat transfer management apparatuses according to the present disclosure includes a composite lamina having an insulator substrate and thermal conductor at least partially embedded in substrate, temperature-sensitive component coupled lamina, temperature-insensitive positioned distally from component. The produces heat during operation. are arranged into targeted region proximate bulk continuity with one another.