Composite laminae having thermal management features and thermal management apparatuses comprising the same

作者: Paul Schmalenberg , Tsuyoshi Nomura , Jae Seung Lee , Ercan Mehmet Dede

DOI:

关键词: ThermalMaterials scienceThermal management of electronic devices and systemsThermal conductivityHeat transferLaminaComposite materialInsulator (electricity)Composite number

摘要: Heat transfer management apparatuses according to the present disclosure includes a composite lamina having an insulator substrate and thermal conductor at least partially embedded in substrate, temperature-sensitive component coupled lamina, temperature-insensitive positioned distally from component. The produces heat during operation. are arranged into targeted region proximate bulk continuity with one another.

参考文章(15)
Leon Klafter, Steven J. Vargo, Alan M. Lyons, John Paul Mello, Madhu Ganesa-Pillai, Jeffrey L. Bream, Stephen A. Ferranti, Heatsink with high thermal conductivity dielectric ,(1999)
Eiji Kikuchi, Shoichi Miura, Masayuki Shiga, Hirosuke Furuta, Takashi Yokota, Substrate for mounting optical components and electric circuit components thereon and method for making same ,(1989)
Robert Michael Smythe, Jeffrey Gerard Hershberger, Michael G. Sutsko, Richard F. Hill, Circuit assemblies including thermoelectric modules ,(2012)
Chi-Hung Kuo, Chih-Hao Chung, Alex Horng, Heat Dissipating Assembly ,(2010)