Energy conditioning circuit arrangement for integrated circuit
作者： William M. Anthony , Anthony A. Anthony
DOI:
关键词: Substrate (printing) 、 Electrical engineering 、 Electronic component 、 EMI 、 Printed circuit board 、 Integrated circuit 、 Energy source 、 Interposer 、 Electrical conductor 、 Engineering
摘要: The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited a single or multiple integrated circuit chips in either combination and elements that could comprise of mounting substrate, module, printed board, other substrates containing conductive energy pathways service utilizing load leading from source. will also possess multi-layer, universal multi-functional, common shield structure with EMI conditioning protection commonly shared centrally positioned pathway electrode the can simultaneously allow smooth interaction grouped energized electrodes architecture it device packaging. be employed component multilayer card. A method making is presented varied individual proprietary construction methodologies exist developed.
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