High density plasma deposition of device quality silicon nitride. II. Effects of thickness on the electrical properties

作者: M. C. Hugon , F. Delmotte , B. Agius , E. A. Irene

DOI: 10.1116/1.591100

关键词: DielectricRange (particle radiation)OptoelectronicsMaterials scienceMicrowaveSpace chargeElectron cyclotron resonancePoole–Frenkel effectPermittivitySilicon nitride

摘要: Dielectric behavior of SiNx films, fabricated by microwave electron cyclotron resonance discharge, has been studied as a function film thickness on the basis current–voltage and capacitance–voltage characteristics. In range (20 nm 20 nm). Finally, spatial profile fixed charges reveals that SiNx/Si interface much greater concentration defects than bulk film.

参考文章(16)
Yoo‐Chan Jeon, Ho‐Young Lee, Seung‐Ki Joo, I‐V characteristics of electron‐cyclotron‐resonance plasma‐enhanced chemical‐vapor‐deposition silicon nitride thin films Journal of Applied Physics. ,vol. 75, pp. 979- 984 ,(1994) , 10.1063/1.356455
S. Sitbon, M. C. Hugon, B. Agius, F. Abel, J. L. Courant, M. Puech, Low temperature deposition of silicon nitride films by distributed electron cyclotron resonance plasma‐enhanced chemical vapor deposition Journal of Vacuum Science and Technology. ,vol. 13, pp. 2900- 2907 ,(1995) , 10.1116/1.579609
S. M. Sze, Current Transport and Maximum Dielectric Strength of Silicon Nitride Films Journal of Applied Physics. ,vol. 38, pp. 2951- 2956 ,(1967) , 10.1063/1.1710030
S. W. Hsieh, C. Y. Chang, Y. S. Lee, C. W. Lin, S. C. Hsu, Properties of plasma‐enhanced chemical‐vapor‐deposited a‐SiNx:H by various dilution gases Journal of Applied Physics. ,vol. 76, pp. 3645- 3655 ,(1994) , 10.1063/1.357428
S Garcia, I Mártil, G Gonzalez Diaz, E Castan, S Dueñas, M Fernández, None, Good quality Al/SiNx:H/InP metal-insulator-semiconductor devices obtained with electron cyclotron resonance plasma method Journal of Applied Physics. ,vol. 83, pp. 600- 603 ,(1998) , 10.1063/1.366647
M. C. Hugon, F. Delmotte, B. Agius, J. L. Courant, Electrical properties of metal–insulator–semiconductor structures with silicon nitride dielectrics deposited by low temperature plasma enhanced chemical vapor deposition distributed electron cyclotron resonance Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. ,vol. 15, pp. 3143- 3153 ,(1997) , 10.1116/1.580859
J. M. Andrews, B. G. Jackson, W. J. Polito, High-field dark currents in thin CVD silicon nitride Journal of Applied Physics. ,vol. 51, pp. 495- 502 ,(1980) , 10.1063/1.327350
Y. C. Park, W. B. Jackson, N. M. Johnson, S. B. Hagstrom, SPATIAL PROFILING OF ELECTRON TRAPS IN SILICON NITRIDE THIN FILMS Journal of Applied Physics. ,vol. 68, pp. 5212- 5221 ,(1990) , 10.1063/1.347064
Kenjirou Watanabe, Shouji Wakayama, Electric conduction in nitrogen‐rich silicon nitride films produced by SiH2Cl2 and NH3 Journal of Applied Physics. ,vol. 53, pp. 568- 575 ,(1982) , 10.1063/1.329920
S.V. Hattangady, G. G. Fountain, R. A. Rudder, R. J. Markunas, Low hydrogen content silicon nitride deposited at low temperature by novel remote plasma technique Journal of Vacuum Science and Technology. ,vol. 7, pp. 570- 575 ,(1989) , 10.1116/1.575891