The effect of the Cr and Mo on the surface accumulation of copper in the electrodeposited Ni–Fe/Cu alloy films
作者： M. Ranjbar , M.M. Ahadian , A. Iraji zad , A. Dolati
DOI: 10.1016/J.MSEB.2005.09.007
关键词: Analytical chemistry 、 Base (chemistry) 、 Impurity 、 Oxygen 、 Alloy 、 Oxide 、 Auger electron spectroscopy 、 Copper 、 X-ray photoelectron spectroscopy 、 Materials science
摘要: Abstract In the present study, surface chemical and depth profile composition of electrodeposited Ni–Fe base alloy layers on Cu substrates were investigated with compositions Ni 80 –Fe 20 (binary) 77 20.7 –Cr 1.7 –Mo 0.6 (quaternary) deposits. Auger electron spectroscopy (AES) X-ray photoelectron (XPS) results showed accumulation copper binary films in form 2 O. quaternary films, addition Cr Mo reduced amount at surface, while was enhanced under air-exposed condition for both films. Depth profiles using secondary ion mass (SIMS) revealed that layers, oxide phases greater than deposit. It is concluded impurities oxygen inside
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