Inductor with conductive trace
作者： Chewn-Pu Jou , Chuei-Tang Wang , Fu-Lung Hsueh
DOI:
关键词: Dielectric 、 Molding (decorative) 、 Electrical engineering 、 Ferrite core 、 Electrical conductor 、 Integrated circuit 、 Magnetic structure 、 Materials science 、 TRACE (psycholinguistics) 、 Inductor
摘要: Among other things, an inductor comprising a conductive trace and method for forming the are provided. The comprises magnetic structure, such as ferrite core. A molding material, dielectric, is formed around structure. trace, one or more pillars interconnected by upper interconnects lower interconnects, structure to form inductor. allows physical limitations associated with winding wire be avoided, thus smaller than wound inductors. In example, within integrated circuit package active device, circuit. this way, can connected package.
google.de 参考文章(23)
Leonard Forbes, Kie Y. Ahn, Integrated circuit inductor with a magnetic core ,(2003)
Wen-Kun Yang, Shih-Li Chen, Wen-Pin Yang, Fan out type wafer level package structure and method of the same US-2006-0091514-A1. ,(2005)
Robert B. Davies, Semiconductor device with inductive component and method of making ,(2005)
Satoshi Hashino, Mitsuaki Hirakawa, Masao Nagano, Multi-parallel magnetic-field cancellation type transformer ,(2009)
Peter Hazucha, Gerhard Schrom, Donald S. Gardner, Fabrice Paillet, Tanay Karnik, Forming inductor and transformer structures with magnetic materials using damascene processing for integrated circuits ,(2010)
Jon Bradley Lasiter, Jitae Kim, Ravindra V. Shenoy, Donald William Kidwell, Evgeni Petrovich Gousev, Philip Jason Stephanou, Kwan-Yu Lai, Through substrate via inductors ,(2012)
Chih Sieh Teng, Ji Zhao, VLSI capacitors and high Q VLSI inductors using metal-filled via plugs ,(1996)
Rongxiang Wu, Xiangming Fang, Johnny Kin On Sin, Large inductance integrated magnetic induction devices and methods of fabricating the same US Patent. ,(2012)
Chong Yoon, Rao Tummala, Baik-Woo Lee, Verkatesh Sundaram, Embedded actives and discrete passives in a cavity within build-up layers ,(2006)