作者: Thomas Sprafke
DOI:
关键词: Temperature induced 、 Image sensor 、 Optics 、 Thermal strain 、 Detector 、 Readout integrated circuit 、 Engineering 、 Flatness (systems theory) 、 Base (geometry) 、 Image detector
摘要: An imaging device and method of fabricating the same is disclosed. The may include an sensor base, image detector a multilayer board. base has bonded hub having uniform flatness. mounting sized to fit into receptacle in match size top surface base. also readout integrated circuit (ROIC) substantially disposed on detector. A plurality equi-spaced flexures receptacles for receiving be used maintain positional stability minimize thermal strain.