Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates

摘要: A method and structure are provided for aligning SMDs to a substrate. The body of an SMD that portion substrate encircled by the electrical interconnect pads each have mating physical such may be quickly placed in general vicinity its proper location features cause precise alignment. In one embodiment, nonsymmetrical, thereby preventing accidental placement undesired rotation. another vary among device types, ensuring improper is not particular on component carrier which includes depressions SMDs. vacuum applied holds place. then desired relationship with devices held properly aligned standard used without requirement features. Those use grid registration pattern ensures components respect