Semiconductor device provided on an organic resin substrate
作者： Setsuo Nakajima , Yasuyuki Arai , Makoto Hosokawa , Akemi Takenouchi
DOI:
关键词: Chemical engineering 、 Semiconductor device 、 Resin coating 、 Organic chemistry 、 Substrate (printing) 、 Materials science
摘要: A semiconductor device using an organic resin substrate, wherein coating is provided on the surface of said substrate and a method for forming same.
lens.org 参考文章(11)
Chi C. Yang, Arindam Banerjee, Subhendu Guha, Method of making pin junction semiconductor device with RF deposited intrinsic buffer layer ,(1992)
Heinz Maass, Method of producing a flexible carrier substrate ,(1989)
Kenji Itoh, Susumu Nagayama, Shunpei Yamazaki, Electronic device manufacturing methods ,(1989)
Masaharu Noyori, Hiroaki Fujimoto, Electronics circuit device and method of making the same ,(1978)
Daniel J. Sandman, Norman J. Geddes, M-I-M' device and fabrication method ,(1989)
Elliot Berman, Flexible photovoltaic device ,(1987)
Charles E. Gazdik, Donald G. McBride, Robert J. Clementi, Joel V. Munson, William Lafer, Roy L. Lovesky, Eugene P. Skarvinko, Flexible film semiconductor chip carrier ,(1986)
Troy Glatfelter, Monolithic, parallel connected photovoltaic array and method for its manufacture ,(1993)
Yasumitsu Ohta, Koichi Kitamura, Kazuyoshi Sai, Kazuo Yamamoto, Hidenori Mimura, Kazuhiko Kawamura, Noboru Otani, Diode and producing method thereof and contact image sensor device comprising the same ,(1990)