Multilayer device and method of making
作者： Anil Raj Duggal , Min Yan , Tae Won Kim , Marc Schaepkens
DOI:
关键词: Substrate (printing) 、 Thermal expansion 、 Materials science 、 Shrinkage 、 Composite material 、 Engineering drawing 、 Layer (electronics) 、 Stress (mechanics) 、 Composite number 、 Curling
摘要: The invention relates to composite articles comprising a substrate and additional layers on the substrate. According one example, are selected so that difference in coefficient of thermal expansion (CTE) between first layer side is substantially equal CTE second other stress caused by and/or shrinkage during heating or cooling balanced cooling. Such balancing can reduce minimize curling
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