作者: Charles C. Bonham , Mac R. Zumhoff , Gordon L. Graff , Kenneth Jeffrey Nelson , Mark E. Gross
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摘要: A method of making an encapsulated plasma sensitive device. The comprises: providing a device adjacent to substrate; depositing protective layer on the using process selected from non-plasma based processes, or modified sputtering processes; and at least one barrier stack layer, comprising decoupling being between substrate stack, wherein both are deposited process, having reduced amount damage caused by compared made without layer. An is also described.