Multi-fluid, two-phase immersion-cooling of electronic component(s)

摘要: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding forming fluid-tight compartment about the component(s), boiling fluid mixture of first second dielectric fluids within compartment, with component(s) immersed mixture. A condensing is also immiscible has lower specific gravity higher thermal conductivity than mixture, facilitates vaporized structure region sub-cooling region, being in contact fluid, heat removal from compartment.