作者: Jr. John W. Mitchell
DOI:
关键词: Printed circuit board 、 Integrated circuit packaging 、 Electrical engineering 、 Identification (information) 、 Electronic engineering 、 Pin grid array 、 Unit (housing) 、 Engineering
摘要: A flexible thin film plastic access unit for placement under a pin grid array installed on printed circuit board. The provides extending exterior flaps having probe-accessible contact pads which connect electrically to each one of the underside pins and permit identification that is probed.