High temperature test fixture
作者： B. Lyle Leigh , Kenneth D. Bowers
DOI:
关键词: Conductor 、 Spring (mathematics) 、 Electrical contacts 、 Structural engineering 、 Mechanical engineering 、 Test fixture 、 Ceramic 、 Engineering 、 Lower temperature
摘要: An apparatus for connecting an electronic device located in a high temperature environment, with test unit lower includes ceramic fixturing plate that is formed at least one hole. The also metal spring conductor clip which has first end and second end. of the selectively insertable into hole to establish electrical contact lead from being tested. At same time, engageable hold on plate. A wire, mechanically electrically connected clip, connects environment.
lens.org 参考文章(8)
William E. Stepan, Robert F. Janninck, Wayne E. Neese, Thomas D. Belanger, Printed circuit connecting device ,(1983)
Koichi Maeda, Haruo Ito, DC characteristics measuring system ,(1982)
David F Rundle, Miniature connector construction{13 adjustable or floating ,(1969)
Harold E. Boesch, James M. McGarrity, Method and apparatus for electrically testing radiation susceptibility of MOS gate devices ,(1980)
Richard Taraci, Brian Taraci, Imre Gorgenyi, Method and apparatus for maintaining electrically operating device temperatures ,(1990)
Jr. John W. Mitchell, Access device unit for installed pin grid array ,(1985)
Andrew M. Valaas, Method of measuring resistance of a control servovalve ,(1987)
Satoshi Habu, Method of measuring the current-voltage characteristics of a DUT ,(1992)