Interconnection of elements on integrated cirrcuit substrate

作者: Michael Francis Crocetti , Bradford Dunham , Luther Bowen Caldwell

DOI:

关键词: PerpendicularPower (physics)Substrate (printing)EngineeringConcentricOptoelectronicsElectrical engineeringElectrical conductorInterconnection

摘要: Concentric patterns of cells or macros (1a, 1b) and conductive lines 13 conserve space on a substrate having two levels. Macros occupy only the first metal level M1 (13) are second M2. The wiring in accordance with this invention has 90° bend it is generally concentric. Wiring M2 perpendicular to spaced from accordingly also Wires (11a, 11b) shown dotted. Interconnection between points (9a, 9B) implies use via holes (15a, 15b) as standard. may contain concentric power buses ground buses.

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