作者: Kazuyuki Sato
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摘要: In a monolithic semi-custom LSI, different types of standard LSI logic sections, each having predetermined configuration and wiring pattern, serving as an independent chip; glue circuits such SSI MSI which have design standards suitable for the same process conditions those constitute peripheral circuit section sections; mask pattern region arbitrarily connecting terminals sections section, bonding pad formed to surround connect them lead wires, are arranged minimize chip size. These constituting elements common hardware master. The connected through single- or multi-layer pattern.