Electrochemical Migration Characteristics of Eutectic Sn-Pb Solder Alloy in NaCl and Na 2 SO 4 Solutions
作者： Ja-Young Jung , Shin-Bok Lee , Ho-Young Lee , Young-Chang Joo , Young-Bae Park
DOI: 10.1007/S11664-008-0636-8
关键词: Soldering 、 Inorganic chemistry 、 Materials science 、 Corrosion 、 Thin film 、 Electrochemical migration 、 Anode 、 Eutectic system 、 Polarization (electrochemistry) 、 X-ray photoelectron spectroscopy
摘要: Anodic dissolution and the electrochemical migration characteristics of eutectic Sn-Pb solder alloy in deaerated 0.001% NaCl Na2SO4 solutions were investigated using anodic polarization water drop tests. results revealed that a Pb-rich phase was preferentially ionized solution an Sn-rich predominantly solution, which coincides well with composition dendrites formed during X-ray diffraction photoelectron spectroscopy showed surface oxide film on pure Sn is more stable than solution. The Pb Therefore, quality chemical environment seems to be critical not only for corrosion resistance, but also resistance.
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sci-hub.se 参考文章(20)
E.F. El-Sherbini, S.S. Abd El Rehim, Electrochemical behaviour of lead electrode in Na2SO4 solutions Materials Chemistry and Physics. ,vol. 88, pp. 17- 22 ,(2004) , 10.1016/J.MATCHEMPHYS.2003.10.020
Denny A Jones, Principles and prevention of corrosion ,(1991)
Fei-Yi Hung, Hung-Mao Lin, Puo-Sheng Chen, Truan-Sheng Lui, Li-Hui Chen, None, A study of the thin film on the surface of Sn–3.5Ag/Sn–3.5Ag–2.0Cu lead-free alloy Journal of Alloys and Compounds. ,vol. 415, pp. 85- 92 ,(2006) , 10.1016/J.JALLCOM.2005.07.050
E.E. Abd El Aal, Studies on the anodic and cathodic polarization of lead in sodium sulphate solution Journal of Power Sources. ,vol. 75, pp. 36- 43 ,(1998) , 10.1016/S0378-7753(98)00080-9
Udit Surya Mohanty, Kwang-Lung Lin, Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 406, pp. 34- 42 ,(2005) , 10.1016/J.MSEA.2005.05.101
Mulugeta Abtew, Guna Selvaduray, Lead-free Solders in Microelectronics Materials Science and Engineering: R: Reports. ,vol. 27, pp. 95- 141 ,(2000) , 10.1016/S0927-796X(00)00010-3
Raymond E. Dessy, Perkin-Elmer Corp. Analytical Chemistry. ,vol. 58, ,(1986) , 10.1021/AC00292A774
D. Q. Yu, W. Jillek, E. Schmitt, Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water Journal of Materials Science: Materials in Electronics. ,vol. 17, pp. 219- 227 ,(2006) , 10.1007/S10854-006-6764-0
Sungil Cho, Jin Yu, Sung K. Kang, DaYuan Shih, The oxidation of lead-free Sn alloys by electrochemical reduction analysis JOM. ,vol. 57, pp. 50- 52 ,(2005) , 10.1007/S11837-005-0136-8
P. Simon, N. Bui, N. Pebere, F. Dabosi, L. Albert, Characterization by electrochemical impedance spectroscopy of passive layers formed on lead-tin alloys, in tetraborate and sulfuric acid solutions Journal of Power Sources. ,vol. 55, pp. 63- 71 ,(1995) , 10.1016/0378-7753(94)02175-3