Interfacial compounds growth of SnAgCu(nano La2O3)/Cu solder joints based on experiments and FEM
作者： Liang Zhang , Li-li Gao
DOI: 10.1016/J.JALLCOM.2015.02.110
关键词: von Mises yield criterion 、 Nano- 、 Metallurgy 、 Intermetallic 、 Soldering 、 Nanoparticle 、 Layer (electronics) 、 Diffusion 、 Materials science 、 Stress (mechanics)
摘要: … joints on Au/Ni metalized Cu pads [8], SrTiO 3 [9] and ZrO 2 [10] nano-particles show … solder, the interfacial microstructures of the SnAgCu/Cu and SnAgCu-nano La 2 O 3 /Cu solder …
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sci-hub.se 参考文章(23)
Liang Zhang, Lei Sun, Yong-huan Guo, Cheng-wen He, Reliability of lead-free solder joints in CSP device under thermal cycling Journal of Materials Science: Materials in Electronics. ,vol. 25, pp. 1209- 1213 ,(2014) , 10.1007/S10854-014-1711-Y
T. Y. Lee, W. J. Choi, K. N. Tu, J. W. Jang, S. M. Kuo, J. K. Lin, D. R. Frear, K. Zeng, J. K. Kivilahti, Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu Journal of Materials Research. ,vol. 17, pp. 291- 301 ,(2002) , 10.1557/JMR.2002.0042
J. S. Kang, R. A. Gagliano, G. Ghosh, M. E. Fine, Isothermal solidification of Cu/Sn diffusion couples to form thin-solder joints Journal of Electronic Materials. ,vol. 31, pp. 1238- 1243 ,(2002) , 10.1007/S11664-002-0015-9
John H. L. Pang, Luhua Xu, X. Q. Shi, W. Zhou, S. L. Ngoh, Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints Journal of Electronic Materials. ,vol. 33, pp. 1219- 1226 ,(2004) , 10.1007/S11664-004-0125-7
Liang Zhang, Song-bai Xue, Li-li Gao, Zhong Sheng, Sheng-lin Yu, Yan Chen, Wei Dai, Feng Ji, Zeng Guang, Reliability study of Sn–Ag–Cu–Ce soldered joints in quad flat packages Microelectronics Reliability. ,vol. 50, pp. 2071- 2077 ,(2010) , 10.1016/J.MICROREL.2010.05.008
Tama Fouzder, Ismathullakhan Shafiq, Y.C. Chan, A. Sharif, Winco K.C. Yung, Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads Journal of Alloys and Compounds. ,vol. 509, pp. 1885- 1892 ,(2011) , 10.1016/J.JALLCOM.2010.10.081
Liang Zhang, Xi-ying Fan, Yong-huan Guo, Cheng-wen He, Properties enhancement of SnAgCu solders containing rare earth Yb Materials & Design. ,vol. 57, pp. 646- 651 ,(2014) , 10.1016/J.MATDES.2013.12.076
A.A. El-Daly, G.S. Al-Ganainy, A. Fawzy, M.J. Younis, Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy Materials & Design. ,vol. 55, pp. 837- 845 ,(2014) , 10.1016/J.MATDES.2013.10.043
Md Muktadir Billah, Kazi Mohammad Shorowordi, Ahmed Sharif, Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties Journal of Alloys and Compounds. ,vol. 585, pp. 32- 39 ,(2014) , 10.1016/J.JALLCOM.2013.09.131
TH Chuang, MW Wu, SY Chang, SF Ping, LC Tsao, None, Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder Journal of Materials Science: Materials in Electronics. ,vol. 22, pp. 1021- 1027 ,(2011) , 10.1007/S10854-010-0253-1