Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy
作者： A.A. El-Daly , G.S. Al-Ganainy , A. Fawzy , M.J. Younis
DOI: 10.1016/J.MATDES.2013.10.043
关键词:
摘要: … The SAC(105) solder was prepared from bulk Sn, Ag and Cu rods (all with 4 N purity). The process … The SAC(105)/SiC composite solders were prepared by mechanically mixing the SiC …
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