Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles
作者： A. A. El-Daly , A. Fawzy , S. F. Mansour , M. J. Younis
DOI: 10.1007/S10854-013-1200-8
关键词: Nucleation 、 Microstructure 、 Soldering 、 Alloy 、 Ultimate tensile strength 、 Materials science 、 Metallurgy 、 Composite number 、 Intermetallic 、 Supercooling 、 Electrical and Electronic Engineering 、 Atomic and Molecular Physics, and Optics 、 Electronic, Optical and Magnetic Materials 、 Condensed matter physics
摘要: … influence of SiC nano-particles … SiC nanoparticles into the SAC(105) alloy melt prompts the formation of primary β-Sn phase with small sub-grain size in the solidified structure. The SiC …
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researchgate.net 参考文章(18)
Lead-free solders : materials reliability for electronics John Wiley & Sons, Ltd. ,(2012) , 10.1002/9781119966203
L.C. Tsao, S.Y. Chang, Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder Materials & Design. ,vol. 31, pp. 990- 993 ,(2010) , 10.1016/J.MATDES.2009.08.008
A.A. El-Daly, M. Abdelhameed, M. Hashish, Walid M. Daoush, Fabrication of silicon carbide reinforced aluminum matrix nanocomposites and characterization of its mechanical properties using non-destructive technique Materials Science and Engineering: A. ,vol. 559, pp. 384- 393 ,(2013) , 10.1016/J.MSEA.2012.08.114
A.A. El-Daly, M. Abdelhameed, M. Hashish, A.M. Eid, Synthesis of Al/SiC nanocomposite and evaluation of its mechanical properties using pulse echo overlap method Journal of Alloys and Compounds. ,vol. 542, pp. 51- 58 ,(2012) , 10.1016/J.JALLCOM.2012.07.102
Witoon Kittidacha, Adirom Kanjanavikat, Kamtida Vattananiyom, Effect of SAC Alloy Composition on Drop and Temp cycle Reliability of BGA with NiAu Pad Finish electronics packaging technology conference. pp. 1074- 1079 ,(2008) , 10.1109/EPTC.2008.4763572
A.R. Geranmayeh, G. Nayyeri, R. Mahmudi, Microstructure and impression creep behavior of lead-free Sn–5Sb solder alloy containing Bi and Ag Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 547, pp. 110- 119 ,(2012) , 10.1016/J.MSEA.2012.03.093
T. Laurila, V. Vuorinen, M. Paulasto-Kröckel, Impurity and alloying effects on interfacial reaction layers in Pb-free soldering Materials Science & Engineering R-reports. ,vol. 68, pp. 1- 38 ,(2010) , 10.1016/J.MSER.2009.12.001
A.A. El-Daly, A.E. Hammad, A. Fawzy, D. A. Nasrallh, Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions Materials & Design. ,vol. 43, pp. 40- 49 ,(2013) , 10.1016/J.MATDES.2012.06.058
R.K. Chinnam, C. Fauteux, J. Neuenschwander, J. Janczak-Rusch, Evolution of the microstructure of Sn–Ag–Cu solder joints exposed to ultrasonic waves during solidification Acta Materialia. ,vol. 59, pp. 1474- 1481 ,(2011) , 10.1016/J.ACTAMAT.2010.11.011
L.C. Tsao, S.Y. Chang, C.I. Lee, W.H. Sun, C.H. Huang, Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder Materials & Design. ,vol. 31, pp. 4831- 4835 ,(2010) , 10.1016/J.MATDES.2010.04.033