Structure and mechanical properties of diamond-like carbon films with copper functional layer by cathode arc evaporation

摘要: Abstract Using direct-current and pulsed cathode arc plasma technique, diamond-like carbon (DLC) bilayer films with Cu functional layer (interlayer surface layer) were prepared on silicon substrate annealed at various temperatures in vacuum. The effects of annealing temperature the structure, morphology mechanical properties investigated. results showed that changed bilayers microstructure, including size sp2 clusters thickness element distribution diffusion layer. A simple three-layer model was used to describe interdiffusion between C layers. interlayer facilitated graphitic rearrangement due weak Cu/C bonds could be more effective against graphitization. Cu/DLC DLC/Cu highly dispersed nano-agglomerates surface, particle roughness largely affected by temperature. hardness stress dependent location possessed a relatively higher lower low 100–400 °C. may interest for studying relaxation DLC can advancing development based engineering materials high properties.