Method and apparatus for liquid treatment of wafer shaped articles
作者： Keisuke Sato , Kei Kinoshita
DOI:
关键词: Electrical engineering 、 Wafer 、 Engineering 、 Optoelectronics 、 Surface (mathematics) 、 Spin-½ 、 Orientation (geometry)
摘要: An apparatus for treating a wafer-shaped article, comprises spin chuck holding article in predetermined orientation, liquid dispenser dispensing treatment onto downwardly facing surface of when positioned on the chuck, and gas within gap defined between downwardly-facing an upper chuck.
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