Method for fabricating semiconductor device and device using same

作者: Ho-Young Kim , Bo-Un Yoon , Il-young Yoon , Bo-Kyeong Kang , Jae-Seok Kim

DOI:

关键词: Materials scienceSubstrate (printing)Buffer (optical fiber)OxideOptoelectronicsIntegrally closedBase (geometry)Semiconductor deviceElectrical engineeringFin (extended surface)

摘要: In a method for fabricating semiconductor device, substrate may be provided that includes: base, an active fin projects from upper surface of the base and is integrally formed with buffer oxide film pattern on in contact fin. A first dummy gate to cover smoothed expose pattern. second exposed film.

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