Semiconductor light emitting device with flexible substrate
作者： Ashim Haque , Paul Martin
DOI:
关键词: Light-emitting diode 、 Light emitting device 、 Flip chip 、 Substrate (printing) 、 Polyimide substrate 、 Optoelectronics 、 Semiconductor 、 Electrical conductor 、 Materials science
摘要: A device includes a flexible substrate, such as polyimide and semiconductor light emitting device, an LED, bonded on conductive regions first side of the substrate in flip chip configuration. The LED is to through, e.g., gold stud bumps. plurality LEDs may be different configurations, individual LEDs, groups or having multiple chips. spooled reel, for bonding shipping purposes. In one embodiment, structure formed by providing LEDs. Gold bumps are formed, contract contacts using thermosonic thermo-compression bonding, then encapsulated.
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