Integrated circuit package pin marking system

作者: Dario H. Impini , Robbie M. K. Chung

DOI:

关键词: Integrated circuitComputer hardwareEngineeringMountIc devices

摘要: An integrated circuit package pin marking system that includes indicia and probe guides. The indicators on the surface of IC package. will be applied to some or all pins, depending number pins present. Additionally, holes slots are adapted guide a selected pin. can used with both through hole mount devices.