Microlabelling system and process for making microlabels

摘要: A method is disclosed for both making microlabels and using these labels to provide a unique system identifying an integrated circuit (IC) die on wafer, in one embodiment, by applying color bar encoded microlabel, small enough be placed the surface of die, with microlabel being order 2 mm×2 mm overall size. In label consists number colored lines or bars similar black/white code, each having distinct hue, width 5-120 micron range terms width, either contiguous separated thin color. The microlabels, whether coded, are applied preferably at wafer probing stage manufacture, wherein labelled code best expressing parameters manufacturer desirous further processing and/or ultimate sales use. specialized real time photographic technique embodiment forming ultra-small labelling microlabel's substrate, process enabling different manufactured on-the-fly carry information associated given die. Further, may additional subsequent stages manufacture. Additionally, capsule device package containing also tagged more microlables. Other techniques producing coded black white, include vapor deposition, metallic foil layering, above requiring shaving layered sheets deposition strips furrows etched scribed sheets. ink jet stripes laid down moving web substrate parallel multi-colored rows. utilized any application which product identification requires exceedingly labels. Moreover, bearing other indicia such as letters numerals, without codes, offers IC manufacturers others microlabelling capability.