Workpiece processing device
作者： Hideo Kino , Minoru Ametani , Isamu Kawashima , Hideshi Sato
DOI:
关键词: Bar (music) 、 Structural engineering 、 Engineering 、 Mechanical engineering 、 Wafer
摘要: A workpiece processing device ( 10 ) for a 60; 20, 36 comprises: surface protection film peeling means 50 110 ), which is adhered to front 21 of workpiece, with tape 4 ); bar code adhering 11 65 corresponding the workpiece; and movable support table 72 supporting workpiece. operation conducted by are given while being supported table. Due foregoing, it possible avoid failures when such as wafer. The may adhere code, corresponds character information read out an optical reading means,
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