作者: Chiu-Feng Yang , Yuan-Hsin Li
DOI:
关键词: Structural engineering 、 Materials science 、 Mechanical engineering
摘要: A separating device for an electronic main body from a substrate bonded thereto comprises platform, conveying section, dissolving cleaning and first partition plate. The section is disposed on the platform moving forward. spraying solvent onto substrate. also body. plate located between has at least one slot, which allows only but not to pass therethrough, so that separated method provided.