Substrate layer cutting device and method
作者： Chrystelle Lagahe-Blanchard , Muriel Martinez , Alain Soubie , Cecile Berne , Olivier Rayssac
DOI:
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摘要: An automatic high-precision layer cutting device for separating a from semiconductor substrate. The includes fixed positioning member receiving at least portion of substrate that has weakened area therein and peripheral annular notch is located below the area. maintains predetermined position on support. also means having one blade contacting inducing cleaving wave into operatively associated with so contacts prevents movement induces sufficient intensity to both divide first second parts detach along
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