Sample processing apparatus and method
作者： Kazutaka Yanagita , Kiyofumi Sakaguchi , Takao Yonehara , Kazuaki Omi
DOI:
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摘要: This invention prevents defects generated when a bonded substrate stack having separation layer is separated. A ( 101 ) porous b separated in two steps of the first and second processes. In process, jet ejected to while rotating partially separate leaving central portion as an unseparated region. rotation stopped. force applied region from predetermined direction completely ). Also, (peripheral portion) (central are using ultrasonic wave, respectively. More specifically, by nozzle 102 On other hand, wave vibrator 1203
lens.org 参考文章(20)
Michael A. Bryan, James K. Kai, Substrate cleaving tool and method ,(1999)
Kiyofumi Sakaguchi, Takao Yonehara, Semiconductor substrate and fabrication method for the same ,(1996)
Francois J. Henley, Nathan Cheung, Controlled cleavage process using pressurized fluid ,(2001)
Volker Lehmann, Ulrich M. Goesele, Method for bubble-free bonding of silicon wafers ,(1989)
Kiyofumi Sakaguchi, Kazuaki Ohmi, Kazutaka Yanagita, Takao Yonehara, Method and apparatus for separating composite member using fluid ,(1998)
Fumio Hamamura, Shigeo Sumi, Film peeling apparatus ,(1986)
Hiroshi Tayanaka, Method for making thin film semiconductor, solar cell, and light emitting diode ,(1997)
Dana F. Schuh, Frank S. Silveira, William P. Tobin, Apparatus and method for controlling the delamination of a laminate ,(1991)
Iwao Hayase, Apparatus for producing semiconductor wafers ,(1994)
Kiyofumi Sakaguchi, Takao Yonehara, Method of manufacturing a semiconductor article ,(1997)