Automatic semiconductor wafer applying apparatus

摘要: Disclosed is an automatic semiconductor wafer applying apparatus capable of lightly easily stacking and loading ring frames onto a frame supply section. This has the following construction. An adhesive tape unwound from roll applied to lower surface supplied position. The cut out along frame. having thereto transported A In this apparatus, truck movable with stacked held thereon arranged so that it can be pushed/transported into pulled out/transported lift unit for receiving, lifting supplying group on pushed installed in