Processing apparatus and wafer processing method
作者： Isamu Kawashima
DOI:
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摘要: There are provide a wafer processing method comprising the steps of securing entirety which is provided, on its right side, with surface protection tape adhered thereto, to frame by dicing underside wafer; irradiating ultraviolet light; and detaching from side wafer, wherein order occurrence an operation for light portion determined based relation between adhesive force before after carried out portion, apparatus carrying method. The may further comprise recognizing reads recognizes recognition mark provided at least one frame. Thus, determined.
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