Method and equipment for producing semiconductor

摘要: PROBLEM TO BE SOLVED: To efficiently discriminate whether a chip can be shipped or not without using any ink mark. SOLUTION: The method for producing semiconductor is provided with process checking the operation of element each formed on wafer (S3-S7), recording result information into data base (S8) and dividing chip, taking out only satisfactory chips through die bonder packaging them based in (S11-S16). equipment fetching means check selecting performing processing to by means.