Die bonding apparatus with automatic die and lead frame image matching system
作者： Kong Song
DOI:
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摘要: A vision system that compares the captured images of a die and lead frame loaded in bonding apparatus with stored thereof, interrupts process when fail to match images. The are directed distinctive features (e.g., positioning size pads) leads) differ between various frames having similar sizes. first camera captures image, second image. digitized passed computer, which previously When mismatch is detected, computer generates an error signal shuts down apparatus.
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