作者: Carlos A. Paz de Araujo , Larry D. McMillan , Joseph D. Cuchiaro
DOI:
关键词: Tungsten nitride 、 Inorganic chemistry 、 Titanium nitride 、 Materials science 、 Niobium nitride 、 Silicon nitride 、 Tantalum nitride 、 Oxide 、 Diffusion barrier 、 Nitride 、 Composite material
摘要: A hydrogen diffusion barrier (130, 330) in an integrated circuit (170, 270, 370, 470) is located to inhibit of a thin film (124) metal oxide material circuit. The comprises at least one the following nitrides: aluminum titanium nitride (Al2Ti3N6), silicon (Al2Si3N6), niobium (AlNb3N6), tantalum (AlTa3N6), copper (Al2Cu3N4), tungsten (WN), and (Cu3N2). ferroelectric or high-dielectric, nonferroelectric material. Preferably, layered superlattice layer directly over oxide.