Method for manufacturing electronic device, electronic device, method for manufacturing electronic device package and electronic device package
作者： Junya Kusunoki , Masakazu Kawata , Etsu Takeuchi , Hiromichi Sugiyama
DOI:
关键词: Conductive materials 、 Electronic component 、 Substrate (printing) 、 Materials science 、 Optoelectronics 、 Nanotechnology
摘要: Disclosed is a method for manufacturing an electronic device, the including: placing component on substrate 11; forming standing portions 13 surface of 11 which 10 placed, comprising thermally decomposable resin; applying encapsulating material 14 so as to encapsulate and cover around while exposing portion each from 14; heating decompose remove 13, thereby holes 141 through conductive 15 in 141.
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