Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method
作者： Hiroaki Fujiwara , Shingo Yoshioka
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摘要: The method of producing a multilayer circuit board includes film-forming step forming swellable resin film on the surface an insulative substrate, groove-forming grooves having depth equal to or greater than thickness external film, catalyst-depositing depositing plating catalyst and film-separating swelling with particular liquid then separating swollen processing electrolessly plated only in region where formed from precursor remains unseparated after separation film.
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