Improved method for micro-roughening treatment of copper and mixed-metal circuitry

作者: David Thomas Baron , Kuldip Singh Johal , Harry Fuerhaupter , Patrick Paul Brooks

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摘要: Process to improve adhesion of dielectric materials a metal layer, including providing an unpatterned layer having first major surface; micro-roughening the surface form micro-roughened and etching circuit pattern in which is carried out prior etching.

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