Solution and process to pretreat copper surfaces

摘要: The invention concerns processes and solutions for the preliminary treatment of copper surfaces which are subsequently to be firmly bonded organic substrates. solution is used, in particular, bonding laminated multilayered printed circuit boards resists boards. contain (a) hydrogen peroxide; (b) at least one acid; (c) nitrogen-containing, five-membered heterocyclic compound does not any sulphur, selenium or tellurium atom heterocycle; (d) adhesive from group consisting sulfinic acids, seleninic tellurinic compounds containing and/or heterocycle, sulfonium, selenonium telluronium salts having general formula (A), A stands S, Se Te; R1, R2 R3 stand alkyl, substituted alkenyl, phenyl, benzyl, cycloalkyl, being same different; X- an anion inorganic acid hydroxide, provided that selected constitute component identical sulfinic, acids as (d).