Adhesion promotion of metal to laminate with a multi-functional compound
作者： Abayomi I. Owei , Joseph A. Abys , Theodore Antonellis , Shenliang Sun , Jean Rasmussen
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摘要: An adhesion promotion composition and method for enhancing between a copper conducting layer dielectric material during manufacture of printed circuit board. The comprises multi-functional compound comprising first functional group second group, wherein the is an aromatic heterocyclic nitrogen selected from consisting vinyl ether, amide, thiamide, amine, carboxylic acid, ester, alcohol, silane, alkoxy combinations thereof.
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