Method for preparing thin copper foil-clad substrate for circuit boards
作者： Masakazu Motegi , Hidenori Kinbara , Morio Gaku , Koichi Ishizuka , Kenzi Ishii
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摘要: A method for preparing a thin copper foil-clad substrate the manufacture therefrom of circuit boards, which comprises subjecting board comprising an electrically insulating support having provided on one or both sides thereof foil average thickness 12 μm more to etching with solution copper, being performed such that whole surface is etched at predetermined rate selected from range 0.01 0.3 μm/sec, thereby reduce least side 10 80% its original thickness, and variation remaining after within ±2.0 basis desired thickness.
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