作者: Atsushi Kanezaki , Masami Watase , Hiroyoshi Harada , Osao Kamada , Tadato Kudo
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摘要: A process for manufacturing a copper-clad laminate which includes rolled copper foil as circuit conductive material comprising, introducing through power supply/guide roller into an electrolyte so to pass between two parallel electrodes are disposed in the electrolyte. An AC, DC or combination thereof is supplied and form etched layer on either one both sides of foil. adhesive applied resultant pressed with substrate made synthetic resin put together laminate.