Metal cored board and method for manufacturing same

作者： Akihiro Ishii , Michihiko Yoshioka , Kimio Chiba , Michio Hirose , Hiroshi Ishibashi

DOI:

关键词: Plating 、 Layer (electronics) 、 Metal 、 Electrically conductive 、 Materials science 、 Composite material 、 Core (manufacturing) 、 Base metal

摘要: It is disclosed that a metal cored board which comprises base core, an easily solderable plating layer formed on one surface of the electrically insulating another and conductive layer, method for manufacturing board, step to plate both core with metal, form layer.