Metal-base multilayer circuit substrate having a heat conductive adhesive layer
作者： Toshiki Saitoh , Makoto Fukuda , Naomi Yonemura , Tomohiro Miyakoshi
DOI:
关键词: Base (chemistry) 、 Substrate (printing) 、 Materials science 、 Conductivity 、 Nitride 、 Composite material 、 Metal 、 Layer (electronics) 、 Adhesive 、 Electrical conductor
摘要: A metal-base multilayer circuit substrate has a metal plate and bonded to the plate, by an insulating adhesive layer containing at least one of oxides and/or nitrides. The high heat conductivity allows for having excellent dissipating properties.
google.it 参考文章(20)
Yakov Belopolsky, Electronic assembly with optimum heat dissipation ,(1991)
Friedrich Bachmann, Method for creating blind holes in a laminated structure ,(1985)
Larry W. Burgess, Multilayer circuit board manufacturing ,(1985)
Kevin W. Brunner, Heatsink conductor solder pad ,(1994)
Jeffrey McKeveny, Ashwinkumar C. Bhatt, Thomas P. Duffy, Gerry A. Hackett, Apparatus for laminating and circuitizing substrates having openings therein ,(1995)
Hirosada Morishita, Kanzi Murakami, Mineo Kawamoto, Method for production of printed circuits by electroless metal plating ,(1976)
Satoru Hayashi, Metal base board and electronic equipment using the same ,(1995)
Craig A. Foster, Kurt R. Raab, Randolfo Galvez, G-tab manufacturing process and the product produced thereby ,(1989)
John Matthew Lauffer, Richard Anthony Schumacher, High circuit density thermal carrier ,(1991)
Akihiro Ishii, Michihiko Yoshioka, Kimio Chiba, Michio Hirose, Hiroshi Ishibashi, Koji Okawa, Hideaki Shirai, Hirokazu Kuzushita, Hirotaka Itoh, Metal cored board and method for manufacturing same ,(1985)