Method for production of printed circuits by electroless metal plating
作者： Hirosada Morishita , Kanzi Murakami , Mineo Kawamoto
DOI:
关键词: Printed circuit board 、 Plating 、 Composite material 、 Nitric acid 、 Gold plating 、 Substrate (printing) 、 Hydrochloric acid 、 Materials science 、 Metal 、 Aqueous solution 、 Chemical engineering
摘要: A method is provided for producing printed circuits by electroless deposition of metal on an insulating substrate to form a circuit film which comprises contacting having initiator negative pattern thermo-setting resin whose activity plating substantially reduced and positive with aqueous solution organic acid hydrochloric and/or nitric before the immersing in dissolve remove surface said pattern.
lens.org 参考文章(8)
Ali Godhan, Lars Eriksson, Preparation of substrate for electroless deposition ,(1969)
George D Nelson, Composition for bright polishing aluminum ,(1960)
Edward Anthony James, Ralph David Distefano, Selective deposition of metal ,(1969)
Tsuneshi Nakamura, Hyogo Hirohata, Method of making printed circuits ,(1967)
Jr Frederick W Schneble, Williamson John Duff, Mccormack John Francis, Zeblisky Rudolph John, Method for electroless copper plating ,(1962)
Michael Gulla, Charles R Shipley, Metallizing a substrate in a selective pattern utilizing a noble metal colloid catalytic to the metal to be deposited ,(1968)
John P Marton, Process for the selective formation of coatings by electroless deposition ,(1970)
Frederick W Schneble, John F Mccormack, Printed circuits,work holders and method of preventing electroless metal deposition ,(1965)