Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board
作者： Hisao Irie , Masanao Kohno , Takao Fukunaga , Kenichi Fuse
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摘要: A paste-like composition containing a lead salt of an organic acid and tin powder is applied on pad array portion circuit board. Then, the compsition heated so as to cause precipitation, thereby forming solder layer formed Sn-Pb alloy substantially only pads. This precipitation performed in state that liquid pool when liquefied by heating, settled pool. When electronic part mounted pads, first, preparatory layers are pads above-mentioned process. After layers, put composition. heated, soldering leads
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