Enhanced osteointegration on tantalum-implanted polyetheretherketone surface with bone-like elastic modulus.

作者: Tao Lu , Jin Wen , Shi Qian , Huiliang Cao , Congqin Ning

DOI: 10.1016/J.BIOMATERIALS.2015.02.018

关键词: Materials scienceExtracellular matrixComposite materialPeekElastic modulusCell adhesionNanoindentationAdhesionBiomedical engineeringOsseointegrationPlasma-immersion ion implantation

摘要: … Afterwards, the samples were washed with distilled water until no color appeared and pictures were taken by fluorescence microscopy (Olympus IX 71, Olympus, Japan). In the …

参考文章(46)
G. E. McGuire, G. K. Schweitzer, Thomas A. Carlson, Core electron binding energies in some Group IIIA, VB, and VIB compounds Inorganic Chemistry. ,vol. 12, pp. 2450- 2453 ,(1973) , 10.1021/IC50128A045
André Anders, Atomic scale heating in cathodic arc plasma deposition Applied Physics Letters. ,vol. 80, pp. 1100- 1102 ,(2002) , 10.1063/1.1448390
André Anders, Metal plasmas for the fabrication of nanostructures Journal of Physics D. ,vol. 40, pp. 2272- 2284 ,(2007) , 10.1088/0022-3727/40/8/S06
Eileen Gentleman, Robin J. Swain, Nicholas D. Evans, Suwimon Boonrungsiman, Gavin Jell, Michael D. Ball, Tamaryn A. V. Shean, Michelle L. Oyen, Alexandra Porter, Molly M. Stevens, Comparative materials differences revealed in engineered bone as a function of cell-specific differentiation. Nature Materials. ,vol. 8, pp. 763- 770 ,(2009) , 10.1038/NMAT2505
Brett Russell Levine, Scott Sporer, Robert A. Poggie, Craig J. Della Valle, Joshua J. Jacobs, Experimental and clinical performance of porous tantalum in orthopedic surgery. Biomaterials. ,vol. 27, pp. 4671- 4681 ,(2006) , 10.1016/J.BIOMATERIALS.2006.04.041
Yoshimitsu Okazaki, Emiko Gotoh, Comparison of metal release from various metallic biomaterials in vitro. Biomaterials. ,vol. 26, pp. 11- 21 ,(2005) , 10.1016/J.BIOMATERIALS.2004.02.005
J Musil, F Kunc, H Zeman, H Poláková, Relationships between hardness, Young's modulus and elastic recovery in hard nanocomposite coatings Surface & Coatings Technology. ,vol. 154, pp. 304- 313 ,(2002) , 10.1016/S0257-8972(01)01714-5