Transient liquid phase bonding of Al 2024 to Ti–6Al–4V alloy using Cu–Zn interlayer
作者： Majid SAMAVATIAN , Alireza KHODABANDEH , Ayoub HALVAEE , Ahmad Ali AMADEH
DOI: 10.1016/S1003-6326(15)63662-7
关键词: Microstructure 、 Eutectic system 、 Energy-dispersive X-ray spectroscopy 、 Intermetallic 、 Metallurgy 、 Scanning electron microscope 、 Eutectic bonding 、 Diffraction 、 Materials science 、 Isothermal process 、 Composite material
摘要: Abstract Transient liquid phase bonding of two dissimilar alloys Al 2024 and Ti–6Al–4V using Cu–22%Zn interlayer was carried out at 510 °C under vacuum 0.01 Pa for various time. In order to characterize the microstructure evolution in joint zone, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) X-ray diffraction (XRD) were applied. The results show that formation is attributed solid-state diffusion Cu Zn into followed by eutectic isothermal solidification along Cu–Zn/Al interface. hardness joints interface increases with an increase time which can be intermetallic compounds such as Al2Cu, TiCu3, Al4.2Cu3.2Zn0.7, Al0.71Zn0.29, Ti2Cu, TiAl3 TiZn16 zone. Moreover, shear strength reaches highest value 37 MPa 60 min.
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